Saint-Gobain Abrasives' Electronics
Saint-Gobain Abrasives' Electronics
Choose from one of the following product categories

1A8 Hubless Diamond Blades

For high-precision slicing and dicing of electronic components

3A1 Hub Dicing Blades

Dicing blades for the optimal combination of wafer dicing quality and productivity

Band Saw Blades

For industrial production processes

Dressing Sticks & Pads

Norton sticks and pads provide exceptional dressing action when initially or periodically conditioning a diamond wheel

Edge & Notch Grinding Wheels

Profile accuracy with optimum surface quality for wafer material performance

Diamond Wire

Our diamond wire demonstrates superior cut rates for wafer sawing hard materials including sapphire, silicon, single-crystal SiC, quartz, and a variety of other ceramic materials.

Flat Grinding Wheels

For generating orientation flats on silicon and a variety of other wafer materials

OD Grinding Wheels

For grinding the outer diameter of silicon ingots

Flexible Superabrasives

Flexible Superabrasive discs fit directly on your lapping equipment for rapid and precise surface generation

ID Saw Blades

Used for slicing germanium and silicon semiconductor materials and a broader set of materials such as GGG, samarium-cobalt, sapphire, magnetic irons, gallium arsenide / phosphide and quartz

OD Saw Blades

Continuous-rim and segmented OD saw blades for a broad range of electronic materials including mono and polycrystallin silicon, sapphire, quartz, specialty glasses, and a variety of other hard compounds and ceramics

Precision Grinding FAVS™ Wheels

Fixed Abrasive Vertical Spindle FAVS™ backgrinding wheels for grinding of Alumina, Gallium Arsenide, Glass, Germanium, Quartz, Silicon, Sapphire, Silicon Carbide, Silicon Nitride, Lithium Niobate, Zirconia and a wide range of other electronic materials.

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