Saint-Gobain Abrasives' Electronics
Saint-Gobain Abrasives' Electronics

Prime Wafer Finishing

The International Technology Roadmap for Semiconductors has projected significant improvements in prime wafer Nano-topology and flatness requirements in the future.

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Saint-Gobain's generation has developed the wheels technology for grinding wire-sawn and etched Silicon wafers while generating ultra low sub-surface damage and very low surface roughness reducing the amount of final polishing. This provides the benefits of increasing wafer yield while improving the cost of ownership. In addition we have also developed specialized wheels for SOI wafers to improve process yield. Saint-Gobain has a portfolio of wheels for customizing your output finish requirements for single side or double side grinding applications.