Saint-Gobain Abrasives' Electronics
Saint-Gobain Abrasives' Electronics
Backgrinding

With the development of new technology in wafer processing, the grind station is seeing more and more of different/new type of wafers. The final requirements/tolerances expected out of the grind stations are also becoming tighter. The coarse grind step within the back grind process is very important as the depth of damage (wafer quality) as well as the removal rate (productivity) is linked with this step. The coarse wheel determines the amount of removal in the fine grind step and also controls the fine grind process performance.   


The wafer quality will depend on a combination of coarse and fine wheels and hence it becomes very important to use a well balanced coarse and fine specification.
Norton FAVS™ team offers a variety of products tailor made to suit individual grind requirements. Based on the wafers to be ground, the Norton FAVS™ wheels can be specified for optimum wafer quality and the best cost of ownership for any of the grind tools used by the industry. 

Standard Back Grind

Standard Back Grind

Thin Wafers

Thin Wafers

Hard to Grind

Hard to Grind

Reclaim Wafers

Reclaim Wafers

Bumped Wafers

Bumped Wafers