Saint-Gobain Abrasives' Electronics
Saint-Gobain Abrasives' Electronics

Prime Wafer Foundries

As the worldwide leaders in abrasives, Saint Gobain Abrasives has the experience and know-how to provide you the state of the art technology for your prime wafer foundry application. Saint-Gobain offers a wide range of products from ID saw blades, fixed abrasive wire sawing wire for wafer slicing and wafer cropping wheels, wafer OD grinding, single side and double side wafer grinding, edge grinding, notch pin grinding wheels etc. for prime wafer finishing.

Fab-PD
The International Technology Roadmap for Semiconductors has projected significant improvements in Nano-topology and flatness requirement for prime wafer. Saint-Gobain has the expertise across the wide range of wafer sizes to provide solutions using our advanced technology. Saint-Gobain's latest generation wheel technology generates ultra low sub-surface damage and very low surface roughness reducing the amount of final polishing required. This provides the benefits of increasing wafer yield while improving cost of ownership. Customers routinely send us wafers for us to conduct testing and to make use of Saint Gobain's wafer characterization services. We have dedicated application testing facilities in Worcester, MA in North America and in Nordestedt, Hamburg in Germany offering solutions for your advanced requirements. Our team of experienced application engineers offer you on-site assistance with your process and our research engineers are continually working on developing the next generation wheel technology.