We offer wheels on all the machine tool platforms being used by the industry. All the Disco, Okamoto (Shibiyama), TSK, G&N & Strasbaugh models are covered under the Norton Winter availability.
Based on the wafer type to be ground, we offer a variety of coarse wheels to suit specific needs. The standard coarse wheel that works on most of the applications is the Norton Winter #320 wheels. These can be offered in varying hardness for grinding different wafer types.
A typical specification would be COARSE#3H1BXL9002.
In an effort to develop the next generation products, the Norton Winter FAVS™ team has introduced a new, engineered bond system that out-performs the competitive abrasive grinding wheels in every aspect of wafer quality. Extensive field testing combined with in-house expertise has resulted in the introduction of a "free cutting" abrasive grinding tool capable of achieving better finish, lower surface stresses, and higher wafer strength.
Increasing demands on wafer quality and cost has forced wafer fabs to optimize the backgrinding process to improve yield. An important factor is the wafer strength after backgrinding. The new engineered bond system grinds intelligently (appropriate self-dressing action) and induces lower surface stresses and lower sub -surface damage, thereby improving the wafer strength. After the initial truing of the grinding wheel, dressing is normally not required while grinding Si/GaAs/Ge wafers. This maintains the consistency between grinds and reduces waste of usable abrasive by dressing.
|Specification*||Norton Winter Mesh||Ra (a)**||Estimated Life***|
|Fine #2 bx623d||600||800-1000||****|
|Polish # 6 bx623d||1500||130-160||150 - 160|
|Polish # 4 bx623d||1700||90-120||120 - 130|
|Polish # 3 bx623d||2000||50-70||100|
Norton Winter Mesh as Applied to Backgrinding Wheels
*Above mentioned specifications are for the finish grinding spindle. The rough grinding spindle normally uses a #320 wheel.
**The finish obtained are on 8" Si wafers.
***The estimated life (relative) is depicted for the above specifications on 8" Si wafers. The wheel hardness (grades) can be changed to suit requirements and optimize life for each mesh size and machine model. Contact us for your specific requirements.
****Recommended for better metal adhesion requirements.