Since the electronics industry's very beginning, we have been at the forefront of high-precision component manufacturing. With worldwide manufacturing, process development, and engineering capabilities, we are uniquely positioned to meet the exacting requirements of the electronics industry on a global basis. We look forward to your technical challenges.
Demonstrates superior cut rates for wafer sawing hard materials, including sapphire, silicon, single-crystal siC, quartz, and a variety of other ceramic materials
Norton Winter dicing blades are designed with premium quality abrasive grains and advanced bond systems for superior and consistent performance on different applications
Used for slicing germanium and silicon semiconductor materials and a broader set of materials such as GGG, samarium-cobalt, sapphire, magnetic irons, gallium arsenide/phosphide, and quartz
Continuous-rim and segmented OD saw blades for a broad range of electronic materials, including mono and polycrystallin silicon, sapphire, quartz, specialty glasses, and a variety of other hard compounds and ceramics
Fixed Abrasive Vertical Spindle (FAVS™) backgrinding wheels for grinding of alumina, gallium arsenide, glass, germanium, quartz, silicon, sapphire, silicon carbide, silicon nitride, lithium niobate, zirconia, and a wide range of other electronic materials
