For industrial production processes

Demonstrates superior cut rates for wafer sawing hard materials, including sapphire, silicon, single-crystal SiC, and quartz

Designed with premium quality abrasive grains and advanced bond systems for superior and consistent performance

Provide exceptional dressing action when initially or periodically conditioning a diamond wheels

Profile accuracy with optimum surface quality for wafer material performance

For generating orientation flats on silicon and a variety of other wafer materials

Used for slicing germanium and silicon semiconductor materials and a broader set of materials

For grinding the outer diameter of silicon ingots

For a broad range of electronic materials, including mono and polycrystallin silicon, sapphire, quartz, and specialty glasses

Alumina, diamond, and nano abrasive slurries for lapping and polishing applications

Provide exceptional dressing action when initially or periodically conditioning a diamond wheel

For use in the manufacturing of thinner and larger-diameter semiconductor wafers

Alumina, diamond, and nano abrasive slurries for lapping and polishing applications

For high-precision slicing and dicing of electronic components