With the development of new technology in wafer processing, the grind station is seeing more and more different and new types of wafers. The final requirements/tolerances expected out of the grind stations are also becoming tighter.

The coarse grind step within the backgrind process is very important as the depth of damage (wafer quality) as well as the removal rate (productivity) is linked with this step. The coarse wheel determines the amount of removal in the fine grind step and also controls the fine grind process performance. The wafer quality will depend on a combination of coarse and fine wheels; and hence, it becomes very important to use a well-balanced coarse and fine specification.