As an industry leader in abrasive grinding technology, our Fixed Abrasive Vertical Spindle (FAVS™) backgrinding wheels are engineered to provide world class quality, consistency, and performance. We provide engineered solutions for grinding of alumina, gallium arsenide, glass, germanium, quartz, silicon, sapphire, silicon carbide, silicon nitride, lithium niobate, zirconia, and a wide range of other electronic materials.
To implement your solutions, we combine state-of-the-art in-house process development capabilities with worldwide on-site application engineering support. A dedicated manufacturing unit ensures the rigorous SPC and quality control standards.
Our dedicated in-house backgrinding equipment allows us to custom develop solutions for you. When customers send their wafers, we conduct evaluations using our advanced wafer characterization services.
We have dedicated application testing facilities in Worcester, MA in North America and in Nordestedt, Hamburg in Germany, offering solutions for your advanced requirements. Our team of experienced application engineers offer you on-site assistance with your process, while our research engineers are continually working on developing the next generation wheel technology.