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    • Wafer Fabrication
      • Diamond Wire
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      • Edge and Notch Grinding Wheels
      • Flat Grinding Wheels
      • ID Saw Blades
      • OD Grinding Wheels
      • OD Saw Blades
      • Polishing Slurries
      • Dressing Sticks and Pads
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      • Precision Grinding FAVS™ Wheels
      • 1A8 Hubless Diamond Blades
      • Dressing Sticks and Pads
      • Nano Wheels
      • Polishing Slurries
  • Applications
    • Backgrinding
    • Chip-Scale Package Singulation
    • Ingot Shaping - Chopping, Rounding, Slabbing
    • LED Substrate Thinning
    • Prime Wafer Finishing
    • Read-Write Head Machining
    • Silicon Wafer Dicing
    • Slicing and Dicing
    • Wafer Sawing
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    • Data Storage
    • LED
    • Opto-Electronics and Telecom
    • Photo-Voltaic
    • Prime Wafer Foundries
    • Semiconductor Fabs
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  3. Prime Wafer Finishing

Prime Wafer Finishing

The International Technology Roadmap for Semiconductors has projected significant improvements in prime wafer Nano-topology and flatness requirements.

We have developed technology for grinding wire-sawn and etched Silicon wafers while generating ultra-low, sub-surface damage and very low surface roughness, reducing the amount of final polishing. This provides the benefits of increasing wafer yield while improving the cost of ownership. In addition, we have also developed specialized wheels for SOI wafers to improve process yield.

Reach out to us to customize your output finish requirements for single side or double side grinding applications.

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  • Edge & Notch Grinding Wheels
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Electronics

Electronics is a business of Norton Abrasives, a brand of Saint-Gobain.

 
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