Semiconductor Fabs

Our team is committed to improving the state of the art in abrasive technology for all fab applications. We offer a wide range of products in back thinning, from standard wheels for all the backgrinding machine OEM platforms to next generation wheels for ultra-thin wafers. We have developed specialized grinding wheels that have the capability to grind 300mm wafers down to 65um thickness. On 200mm wafers, we have developed wheels that can grind wafers down to 65 um and can be handled without any additional stress relief.

We also have specialized wheels for grinding GaAs, Germanium, SOI, Bonded, Reclaim wafers and other specialized applications. Our in-house dedicated backgrinding equipment allows us to custom develop solutions for our customers. Customers accustomed to using older technology and higher cost of ownership now step up to the latest in thinning technology with lower cost of ownership.

Customers routinely send us their wafers for us to conduct testing and to make use of our advanced wafer characterization services. We have dedicated application testing facilities in Worcester, MA in North America and in Nordestedt, Hamburg in Germany, offering solutions for your advanced requirements. Our team of experienced application engineers offer you on-site assistance with your process, and our research engineers are continually working on developing the next generation wheel technology.

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