Slicing and Dicing

Industry-Leading Diamond Blade Technology and Application Expertise

With over 30 years' experience in slicing and dicing electronic components, we have the technology and know-how to develop or optimize your process. Whether you slice opto-electronic components, multi-layer capacitors, diodes, or any high-precision ceramic part, we offer the industry's broadest range of sizes and specifications to match your application. When you need to push the limits on blade thickness, feed rate, or cut accuracy, contact us with your technical challenges. 

World-Class R&D and Engineering Capabilities

Offering unparalleled expertise in high-precision slicing and dicing, backed up by world-class process modeling capabilities, our development lab is staffed by industry experts and fully equipped with industry-standard slicing & grinding systems and metrology tools, enabling exact replication of customer set-ups for turn-key solution development.

Advanced Data Acquisition Systems

Field Instrumentation System (FIS) 

The FIS combines proprietary software and hardware to record and analyze grinding process data (power, force, machine slide position, etc.) over time. It is a key analysis tool to assess grinding process stability and self-sharpening characteristics of diamond blades.

View Voyager Optical Measurement System

Blob analysis and optical measurement based on pre-calibrated view. Used for cut quality optimization. Measurement capabilities include: chipping, part geometry, kerf control, and cut taper.

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